Shenzhen Chinasky Laser Technology Co., Ltd. em i wanpela bilong ol profesenel manifakta na saplaia bilong uv laser katim masin long Saina. Plis yu no ken pret long baim gutpela masin bilong katim 'uv laser' wantaim 2-pela yia waranti long faktori bilong mipela. Mipela i save kisim tu ol oda we yu laikim.
Samting na Gutpela Samting
Bikpela Material Kompatibiliti
Em i save prosesim gut ol samting we i hat long yusim ol narapela laser, olsem ol plastik, seramik, glas, na ol metal we i save lait gut tru olsem kopa na aluminium.
Ol Advans Mosen Sistem
Ol 'high-precision linear motors na galvanometer scanners i save givim gutpela spit na stretpela wok long ol kompleks rot bilong katim.
Integreted Vision Alignment
Ol hai-resolusen kamera i save painim na stretim ol kat i go long ol mak o paten, na dispela i save mekim ol PCB na ol semikondakta komponen i wok gut tru.
Ol gutpela eria bilong prosesim
I gat bikpela 460 mm x 460 mm maksimum laser wok ranj bilong ol bikpela panel o planti lain, wantaim wanpela gutpela 50 mm x 50 mm liklik-prosesing eria. Dispela 'dual-range kapabiliti i givim bikpela fleksibiliti, stat long prosesim ol bikpela-fomat materiel i go inap long wokim ol liklik samting we i no isi tumas na i gat bikpela stretpela wok.
Gutpela Proses Detabes
Wanpela gutpela databes i larim ol klaien long wokim na sevim ol 'cutting parameter' laibreri bilong olgeta prodak. Dispela i rausim ol rong we ol i save mekim long han na i mekim ol gutpela samting i kamap gut, na ol i ken mekim gen maski opereta i gat wanem kain ekspiriens.
Hai-Spid Presisen Mosen Sistem (XY-Eksis)
I gat wanpela 'high-performance motion platform we i save givim spit bilong 800 mm/s na bikpela 1G akseleresen. Dispela i mekim wok i kamap hariap na i daunim tru taim bilong wok nating, na i strongim tru olgeta wok na wok bilong ol liklik na bikpela 'batch' prodaksen.
Streamlain Software Operesen
Dispela 'software interface' i gat ol gutpela wok olsem "Selective Cutting," "Tool-Based Cutting," na "Material-Specific Parameter Presets." Dispela i mekim wok i kamap isi long sampela klik tasol, na i daunim taim bilong trening bilong opereta na stopim ol asua.
Otomatik Prodaksen Histri na Rikol
Sistem i save rekodim olgeta data bilong katim olgeta prodak. Long senisim wok, ol opereta i save makim nem bilong prodak long lista bilong tingim bek olgeta paramita hariap, na dispela i mekim na ol i ken senisim hariap na rausim ol asua bilong setim ol prodak we ol i bin pruvim pinis.
Advans Opereta Menesmen na Odit Trail i Givim
Ol edministreta wantaim ol strongpela tul bilong sekim. Sistem i save logim olgeta wok bilong opereta, na tu, taim bilong login/logout, olgeta senis bilong ol paramita, na olgeta histori bilong ol fail we ol i bin katim. Dispela i mekim na ol i ken painim olgeta samting na ol i ken bekim gut ol samting na i helpim wok bilong skelim gut ol samting.
Wok
- Semikondakta na IC Pakejing:Wafer dicing (singulation), silicon cutting, ceramic substrate cutting, na prosesing bilong ol 'lead frames'.
- Fleksibel Elektroniks (FPC):Katim na drilim stret ol 'Flexible Printed Circuits' (FPC), ol 'coverlays', na ol 'thin polyimide' (PI) na PET leia.
- Precision Engineering:Katim ol liklik metal (kopa, aluminium foil), wokim ol 'micro-electromechanical systems (MEMS), na wokim ol gutpela 'mesh' na 'filter'.
- Konsuma Elektroniks:Katim glas na safaia bilong ol kamera modul, ol 'touch sensor', na ol samting bilong soim; makim na katim ol samting bilong smatfon.
FAQ
Q: Olsem wanem wanpela UV laser i save katim narapela kain long wanpela CO2 o fiber laser?
A: CO2 na ol 'fiber laser' i save yusim hat long meltim o mekim ol samting i kamap olsem 'vaporize' tasol UV laser i save yusim wanpela "kol" proses ol i kolim 'photo-ablation'. Sotpela wevlengt bilong en na bikpela 'photon energy' bilong en i save brukim ol 'molecular bond' bilong dispela samting stret, na rausim ol samting stret wantaim liklik hat i go long ol samting i stap klostu.
Q: Wanem ol samting we UV laser inap long katim gut?
A: Ol UV laser i save gut tru long katim planti kain kain samting we i no strong tumas na i gat hatwok long en, olsem:
● Ol plastik na polima: Polyimide (PI), PET, PEEK, PTFE, na ol narapela plastik bilong enjiniaring.
● Ol metal we i liklik na i save lait: Ol kopa, aluminium, gol, na silva foil we i no save lait long lait.
● Seramiks: Alumina, zirconia, na ol narapela samting bilong putim aninit long en we i no gat liklik bruk.
● Glass & Sapphire: Bilong klinim, kontrolim ol katim na drilim na i no bruk.
● Ol Samting Bilong Semikondakta: Silikon, Gallium Arsenide, na ol narapela semikondakta.
Q: Wanpela masin bilong katim 'UV laser' i stret olsem wanem?
A: Gutpela wok bilong masin bilong katim ol samting long UV laser em i antap tru. Liklik 'focal light spot' inap long stap aninit long 20 um, na 'cutting edge' i liklik tru. Ol masin inap long kisim wanpela 'positioning accuracy' bilong ±3 um na wanpela 'repeat accuracy' bilong ±1 um, wantaim wanpela 'system processing accuracy' bilong ±20 um.
Q: Wanem ol bikpela gutpela samting bilong "cold cutting" proses?
A: Ol bikpela gutpela samting em
- Nogat bagarap long hat: I rausim paia, melt, na hat-indusim defomesen.
- Gutpela Arere Kwaliti: I kamapim ol gutpela, stretpela wol na i no gat ol 'burrs' o 'slag'.
- Minimal HAZ: Em i lukautim gutpela bilong ol samting i stap klostu long hap we ol i katim.
- Inap long katim ol samting we i no hat tumas: Em inap long wokim ol samting we ol 'thermal laser' inap long bagarapim.
Q: Wanem mak bilong tiknes bilong ol samting we ol i katim wantaim UV laser?
A: Ol UV laser em ol i gutpela long mekim wok stret long ol liklik na liklik samting. Gutpela mak em i stat long 1 maikron i go inap long 1-2 mm, i dipen long ol samting bilong dispela samting. Ol i no wokim bilong katim ol tikpela ain plet o blok.
Q: UV laser sistem em i gutpela long yusim?
A: Tru tumas. Laser i stap insait long wanpela 'safety interlocked cabinet', na dispela i mekim na i no gat wanpela nogut UV rediesen i ken ranawe taim em i wok. Ol opereta i ken putim na rausim ol hap bilong en gut na i no gat hevi bilong kisim bagarap.
Hot Tag: uv laser katim masin, Saina uv laser katim masin manifakta, saplaia, faktori
Ol Teknikel Paramita
|
Model |
HT-UVC15 |
|
Laser pawa |
15 W |
|
Kain laser |
UV Laser |
|
Laser wavelength |
355 nm |
|
Wanpela Proses Eria |
50×50 mm |
|
Olgeta Prosesing Renj |
460 mm × 460 mm (Yu ken senisim) |
|
CCD Auto-Alignment Accuracy |
±3 μm |
|
Auto-Focus Fanction |
Yes |
|
XY-Aksis Repositioning Accuracy |
±1 μm |
|
XY-Stretpela Posisen bilong Aksis |
±3 μm |
|
Ol fomat bilong fail we ol i sapotim |
DXF, DWG, GBR, CAD na moa |
